Semiconductor device package and method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWen-Long Lu
Life of this patent
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Abstract
A semiconductor device package includes a circuit layer, an electronic component, an electronic component, a first passivation layer and a second passivation layer. The circuit layer has a first surface. The electronic component is disposed on the first surface of the circuit layer. The first passivation layer is disposed on the first surface of the circuit layer. The first passivation layer has a first surface facing away the circuit layer. The second passivation layer is disposed on the first surface of the first passivation layer. The second passivation layer has a second surface facing away the circuit layer. A uniformity of the first surface of the first passivation layer is greater than a uniformity of the second surface of the second passivation layer.
Claims13
A semiconductor device package, comprising:
- a circuit layer having a first surface;
- an electronic component disposed on the first surface of the circuit layer;
- a first passivation layer disposed on the first surface of the circuit layer, the first passivation layer having a first surface facing away the circuit layer;
- a second passivation layer disposed on the first surface of the first passivation layer, the second passivation layer having a second surface facing away the circuit layer;
- a third passivation layer disposed on the second surface of the second passivation layer, wherein the third passivation layer having a third surface facing away the circuit layer, and the third surface of the third passivation layer is more even than the second surface of the second passivation layer;
- and
- a conductive layer disposed on the third surface of the third passivation layer and penetrating the second passivation layer and the third passivation layer to be electrically connected to a conductive pad of the electronic component,
- wherein the first surface of the first passivation layer is less even than the second surface of the second passivation layer.
Dependencies are inferred from the claim text.