Power semiconductor module
AssigneeABB Schweiz AG
InventorsDavid Guillon, Charalampos Papadopoulos, Dominik Truessel, Fabian Fischer, Samuel Hartmann
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Abstract
The present application provides a power semiconductor module, including a support which carries at least one power semiconductor device, the support together with the power semiconductor device is at least partly located in a housing, the support and the power semiconductor device are at least partly covered by a sealing material, additionally to the sealing material, a protecting material is provided in the housing, the protecting material is formed from silicon gel and the protecting material at least partly covers at least one of the support, the power semiconductor device and the sealing material.
Claims20
A power semiconductor module, comprising
- a support which carries at least one power semiconductor device, wherein
- the support together with the power semiconductor device is at least partly located in a housing, wherein
- the support and the power semiconductor device are at least partly covered by a sealing material, wherein
- additionally to the sealing material, a protecting material is provided in the housing, wherein
- the protecting material is formed from silicon gel and wherein
- the protecting material at least partly covers at least one of the support, the power semiconductor device and the sealing material, wherein
- the sealing material comprises a contact area to the protecting material, wherein said contact area comprises protrusions and/or recesses proceeding into the protecting material.
Dependencies are inferred from the claim text.