Apparatus and method of selective turning over a row of substrates in an array of substrates in a processing system

A device for manipulating at least a first row of wafers and a second row of wafers, comprising:

• a first holder configured to hold the first row of wafers, the first holder having a first rod and a second rod, the first rod and the second rod of the first holder facing each other directly and defining a space therebetween for accommodating the first row of wafers, wherein a distance between the first rod and the second rod of the first holder facing each other directly is variable;
• and
• a second holder configured to hold the second row of wafers, the second holder having a first rod and a second rod, the first rod and the second rod of the second holder defining a space therebetween for accommodating the second row of wafers, wherein a distance between the first rod and the second rod of the second holder is variable;
• wherein the first holder is longer than the wafers in the first row of wafers, thereby providing the first holder with an ability to simultaneously hold the wafers in the first row of wafers.