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US 10,854,495 B2Granted
Adhesive tape for semiconductor processing, and semiconductor device manufacturing method
AssigneeLintec Corporation
InventorsKazuto Aizawa, Jun Maeda
Life of this patent
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Abstract
A pressure sensitive adhesive tape for semiconductor processing includes a base having a Young's modulus of 1000 MPa or more at 23° C., and a pressure sensitive adhesive layer provided on at least one surface of the base, and the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) [μm] is a thickness of the pressure sensitive adhesive layer and (C) [μm] is a creep amount.
Claims11
A pressure sensitive adhesive tape for semiconductor processing, comprising:
- a base having a Young's modulus of 1000 MPa or more at 23° C.,
- a buffer layer provided on at least one surface of the base, and
- a pressure sensitive adhesive layer provided on the other surface of the base,
- wherein the product (N)×(C) of (N) and (C) is 500 or more at 30° C., and 9000 or less at 60° C., where (N) is a thickness of the pressure sensitive adhesive layer and (C) is a creep amount.
1 more element
Dependencies are inferred from the claim text.