Method for manufacturing a handling device and method for reversible bonding using such a device

A method for reversible bonding, the method comprising:

• producing a handling device by performing
• a step of deposition of a single layer of an adhesive on a first surface of a first wafer;
• a step of deposition of an antiadhesive layer on a first surface of a second wafer different from the first wafer;
• a step of bringing into contact the first wafer and the second wafer, the bringing into contact taking place at a level of the single adhesive layer of the first wafer and the antiadhesive layer of the second wafer;
• a step of separation of the first wafer and the second wafer so as to leave the single adhesive layer on the first wafer;
• the first wafer comprising the single adhesive layer forming the handling device, wherein the step of bringing into contact the first wafer and the second wafer is carried out at a temperature TC such that TC>Tg+100° C. where Tg is a glass transition temperature of a material composing the single adhesive layer of the first wafer, and
• bringing into contact said handling device with a third wafer, the bringing into contact of said handling device with said third wafer taking place at a level of the surface comprising the single adhesive layer,
• wherein the step of bringing into contact the handling device with the third wafer is carried out at a temperature TCW such that Tg<TCW<Tg+50° C. where Tg is the glass transition temperature of the material composing the single adhesive layer of the handling device.