Substrate processing method and substrate processing apparatus

A substrate processing method comprising:

• a substrate holding step of holding a substrate horizontally;
• a processing liquid supply step of supplying a water-containing processing liquid to an upper surface of the substrate;
• a liquid film forming step of forming a liquid film of a low surface tension liquid, having a lower surface tension than water, that covers the upper surface, by supplying the low surface tension liquid to the upper surface of the substrate to replace the processing liquid on the substrate with the low surface tension liquid;
• an opening forming step of supplying a gas to a center region of the liquid film to form an opening in the center region of the liquid film;
• an opening widening step of widening the opening in order to remove the liquid film;
• a substrate rotating step of rotating, in the opening widening step, the substrate around a predetermined rotational axis along a vertical direction;
• a gas supply position moving step of blowing, in the opening widening step, the gas toward a gas supply position that is set further inward than a peripheral edge of the opening on the upper surface of the substrate, and moving the gas supply position toward the peripheral edge of the upper surface of the substrate;
• and
• a liquid landing position moving step of supplying, in the opening widening step, the low surface tension liquid toward a liquid landing position that is set further outward than the peripheral edge of the opening on the upper surface of the substrate, and moving the liquid landing position toward the peripheral edge of the upper surface of the substrate.