Wiring substrate

A wiring substrate comprising:

• a first insulating layer;
• a plurality of wiring patterns formed on one surface of the first insulating layer;
• a dummy pattern formed, on the one surface of the first insulating layer, between nearby wiring patterns;
• and
• a second insulating layer made of resin and formed on the one surface of the first insulating layer so as to cover the nearby wiring patterns and the dummy pattern,
• wherein the dummy pattern is a dot pattern arranged at a center portion between the nearby wiring patterns,
• wherein a height of at least one dot constituting the dummy pattern is lower than heights of the nearby wiring patterns,
• wherein the center portion is an area, with respect to a center line passing through a center between side surfaces of the nearby wiring patterns, within ±2 L in directions towards the side surfaces of the nearby wiring patterns in plan view where L is a diameter of the at least one dot in plan view,
• wherein the dummy pattern is arranged only within the center portion,
• wherein the nearby wiring patterns and the dummy pattern protrude from the one surface in a thickness direction of the wiring substrate, and
• wherein between the nearby wiring patterns and on the one surface, only the dummy pattern is arranged within the center portion and no other patterns are arranged.