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US 10,854,473 B2Granted
Polishing method, polishing apparatus, and substrate processing system
AssigneeEbara Corporation
InventorsYu Ishii, Kenya Ito, Keisuke Uchiyama, Masayuki Nakanishi
Life of this patent
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Abstract
A polishing method capable of polishing a substrate, such as a wafer, with low running costs is disclosed. A polishing method includes: rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage; rotating a polishing head holding a plurality of polishing tools; and polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate. The front-side surface is a surface on which interconnect patterns are to be formed.
Claims17
A polishing method comprising:
- rotating a substrate while holding a back-side surface of the substrate with a vacuum suction stage;
- rotating a polishing head holding a plurality of polishing tools;
- and
- polishing a front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate while directing a liquid to a target area of the front-side surface, with the liquid in approximately parallel to the front-side surface of the substrate, the target area being located upstream of the polishing head with respect to a rotating direction of the substrate, the front-side surface being a surface on which interconnect patterns are to be formed.
1 more element
A polishing method comprising:
- preparing a substrate having a front-side surface on which interconnect patterns are to be formed and a back-side surface on which no interconnect patterns are to be formed;
- rotating the substrate while holding the back-side surface of the substrate with a vacuum suction stage;
- rotating a polishing head holding a plurality of polishing tools;
- and
- polishing the front-side surface of the substrate by pressing the plurality of polishing tools, which are rotating, against the front-side surface of the substrate while oscillating the polishing head parallel to the front-side surface of the substrate and while directing a liquid to a target area of the front-side surface, with the liquid in approximately parallel to the front-side surface of the substrate, the target area being located upstream of the polishing head with respect to a rotating direction of the substrate.
2 more elements
A polishing apparatus comprising:
- a vacuum suction stage having a holding surface configured to hold a back-side surface of a substrate;
- a stage motor configured to rotate the vacuum suction stage;
- a polishing head;
- a plurality of polishing tools attached to the polishing head;
- a liquid supply nozzle configured to supply a liquid, the liquid supply nozzle being oriented toward a position upstream of the polishing head with respect to a rotating direction of the vacuum suction stage, the liquid supply nozzle having an ejection orifice disposed in a direction approximately parallel to the holding surface;
- a head motor configured to rotate the polishing head and the plurality of polishing tools;
- and
- an actuator configured to exert a downward load on the polishing head to cause the polishing head to press the plurality of polishing tools against a front-side surface of the substrate.
5 more elements
A substrate processing system for processing substrates successively, comprising:
- a polishing apparatus;
- a particle counter configured to count the number of fine protrusions existing on a front-side surface of a substrate that has been polished by the polishing apparatus;
- an operation controller configured to receive the number of fine protrusions and change a polishing recipe for polishing a next substrate in the polishing apparatus,
- wherein the polishing apparatus includes:
- a vacuum suction stage having a holding surface configured to hold a back-side surface of the substrate;
- a stage motor configured to rotate the vacuum suction stage;
- a polishing head;
- a plurality of polishing tools attached to the polishing head;
- a liquid supply nozzle configured to supply a liquid, the liquid supply nozzle being oriented toward a position upstream of the polishing head with respect to a rotating direction of the vacuum suction stage, the liquid supply nozzle having an ejection orifice disposed approximately parallel to the holding surface;
- a head motor configured to rotate the polishing head and the plurality of polishing tools;
- and
- an actuator configured to exert a downward load on the polishing head to enable the polishing head to press the plurality of polishing tools against the front-side surface of the substrate.
9 more elements
Dependencies are inferred from the claim text.