Method and equipment for performing CMP process

A method, comprising:

• providing a liquid containing composition from a tank to a nozzle through at least one tube fluidly coupled with the tank and the nozzle, the at least one tube comprising a photocatalyst therein;
• applying light from a light source to irradiate the photocatalyst, and the liquid containing composition passing through the at least one tube;
• and
• applying the liquid containing composition from the nozzle to a pad for chemical-mechanical planarization (CMP) of a semiconductor substrate.

A method comprising:

• providing a liquid containing composition from a tank to a nozzle through at least one tube fluidly coupled with the tank and the nozzle, the at least one tube comprising a photocatalyst therein, wherein the liquid containing solution is a slurry or a solution comprising hydrogen peroxide, and wherein the photocatalyst comprises a transition metal or a compound thereof;
• applying light from a light source to irradiate the photocatalyst, and the liquid containing composition passing through the at least one tube, wherein the light is visible light or ultraviolet light;
• and
• applying the liquid containing composition from the nozzle to a pad for chemical-mechanical planarization (CMP) of a semiconductor substrate while rotating the pad.