Deposition of organic films
AssigneeASM IP Holding B.V.
InventorsEva E. Tois, Hidemi Suemori, Viljami J. Pore, Suvi P. Haukka, Varun Sharma
Life of this patent
Estimating the term…
Abstract
Processes are provided herein for deposition of organic films. Organic films can be deposited, including selective deposition on one surface of a substrate relative to a second surface of the substrate. For example, polymer films may be selectively deposited on a first metallic surface relative to a second dielectric surface. Selectivity, as measured by relative thicknesses on the different layers, of above about 50% or even about 90% is achieved. The selectively deposited organic film may be subjected to an etch process to render the process completely selective. Processes are also provided for particular organic film materials, independent of selectivity.
Claims21
A process for depositing a polyamide film on a substrate comprising a first surface and a second surface, the process comprising one or more deposition cycles comprising:
- contacting the first surface and the second surface of the substrate with a first vapor phase precursor comprising 5 or fewer carbon atoms;
- contacting the first surface and the second surface of the substrate with a second vapor phase precursor comprising 3 or fewer carbon atoms;
- wherein contacting the substrate with the first and second vapor phase precursors forms the polyamide film of a desired thickness selectively on the first surface of the substrate relative to the second surface of the substrate.
Dependencies are inferred from the claim text.