Plasma generating device, plasma sputtering device, and plasma sputtering method
AssigneeTohoku University
InventorsKazunori Takahashi, Jun Fukushima, Akira Ando, Yasumasa Sasaki
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AssigneeTohoku University
InventorsKazunori Takahashi, Jun Fukushima, Akira Ando, Yasumasa Sasaki
Estimating the term…
A plasma sputtering device including one or a plurality of plasma generating devices each including an insulating tube having an expanding inner diameter and having a gas injection port formed in an end portion or a side portion thereof, a first electromagnet or a permanent magnet group which can apply a static magnetic field, and a high frequency antenna; a second electromagnet which is disposed in a region downstream of the plasma generating device(s) and which can form a curved magnetic force line structure; a target mechanism which includes a permanent magnet embedded therein and a cooling mechanism and which can apply a DC or high frequency voltage; a substrate stage facing the target mechanism; a second permanent magnet group around the substrate stage; and a heat insulating mechanism between a target material and the target mechanism.
A plasma sputtering method characterized in that one or a plurality of plasmas are generated by one or a plurality of plasma generating devices each having an insulating tube having an expanding inner diameter and having a gas injection port formed in an end portion or a side portion of the insulating tube, a first electromagnet or a permanent magnet member group which can apply a static magnetic field, and a high frequency antenna;
A plasma sputtering device characterized by comprising:
A plasma generating device characterized by comprising:
Dependencies are inferred from the claim text.