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US 10,854,442 B2Granted
Orientation chamber of substrate processing system with purging function
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorWei-Hua Houng
Life of this patent
Estimating the term…
Abstract
An orientation chamber of a semiconductor substrate processing system is provided. The orientation chamber includes a substrate holder, an orientation detector, and a purging system. The substrate holder is configured to hold a substrate. The orientation detector is configured to detect the orientation of the substrate. The purging system is configured to inject a cleaning gas into the orientation chamber and remove contaminants from the substrate.
Claims20
An orientation chamber, comprising:
- a substrate holder configured to hold a substrate;
- an orientation detector configured to detect an orientation of the substrate;
- a purging system configured to inject a cleaning gas into the orientation chamber and remove contaminants from the substrate;
- and
- a driving mechanism configured to drive the substrate holder to rotate the substrate according to a position signal output from the orientation detector.
2 more elements
A method of processing a substrate, comprising:
- providing a semiconductor substrate processing system for substrate processing which includes an orientation chamber and a process module;
- orienting the substrate in the orientation chamber by driving a substrate holder to rotate the substrate according to a position signal output from an orientation detector;
- processing the substrate in the process module;
- transferring the processed substrate from the process module to the orientation chamber;
- and
- conducting a degassing process in the orientation chamber.
3 more elements
A method of processing a substrate, comprising:
- providing a semiconductor substrate processing system for substrate processing which includes an orientation chamber and a process module;
- orienting the substrate in the orientation chamber;
- injecting a first cleaning gas into the orientation chamber to remove particulate contaminants on the substrate while orienting the substrate in the orientation chamber;
- processing the substrate in the process module;
- transferring the processed substrate from the process module to the orientation chamber;
- and
- injecting a second cleaning gas into the orientation chamber to remove halogen gas outgassed from the processed substrate.
4 more elements
Dependencies are inferred from the claim text.