US 10,854,383 B2Granted

Coil electronic component and method of manufacturing the same

AssigneeSamsung Electro-Mechanics Co., Ltd.

InventorMin Sung Choi

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Abstract

A coil electrode component includes a body including magnetic metal material, a coil disposed in the body and having first and second lead parts respectively outwardly exposed through first and second surfaces of the body. A first plating electrode is formed on the first surface of the body and a further surface of the body connected to and extended from the first surface of the body, and connected to the first lead part. A second plating electrode is formed on the second surface of the body and a further surface of the body connected to and extended from the second surface of the body, and connected to the second lead part.

Claims23

Dependent claims

A coil electronic component comprising:

a body including a resin having dispersed therein magnetic metal particles;
a coil disposed in the body and having first and second lead parts respectively outwardly exposed to first and second surfaces of the body;
a first plating electrode disposed on at least a portion of the first surface of the body, including the resin having dispersed therein the magnetic metal particles, and on at least a portion of a further surface of the body connected to and extending from the first surface, and connected to the first lead part;
a second plating electrode disposed on at least a portion of the second surface of the body, including the resin having dispersed therein the magnetic metal particles, and on at least another portion of the further surface of the body connected to and extending from the second surface, and connected to the second lead part;
and
an insulating layer disposed on the further surface between the first and second plating electrodes and extending in a thickness direction to at least an outer surface of at least one of the first or second plating electrode in the thickness direction,
wherein each of the first and second plating electrodes comprises plural plating layers including a first plating layer that includes copper (Cu) and contacts the body and one of the first and second lead parts,
wherein a portion of the first plating electrode disposed on the first surface directly contacts a first magnetic metal particle among, the magnetic metal particles and a portion of the first plating electrode disposed on the further surface is spaced apart from the magnetic metal particles, and
wherein a portion of the second plating electrode disposed on the second surface directly contacts a second magnetic metal particle among the magnetic metal particles and a portion of the second plating electrode disposed on the further surface is spaced apart from the magnetic metal particles.

6 more elements

A method of manufacturing a coil electronic component, the method comprising:

forming a coil having a first lead part and a second lead part;
forming a body by laminating, magnetic sheets including a resin having dispersed therein magnetic metal particles on an upper portion and a lower portion of the coil;
and
forming first and second plating electrodes on outer surfaces of the body by forming plural plating layers including a first plating layer that includes copper (Cu) and contacts the body, including the resin having dispersed therein the magnetic metal particles, and one of the first and second lead parts,
wherein the first plating electrode is disposed on at least a portion of a first surface of the body and on at least a portion of a further surface of the body connected to and extending from the first surface of the body, and connected to the first lead part,
wherein the second plating electrode is disposed on at least a portion of a second surface of the body and on at least another portion of the further surface of the body connected to and extending from the second surface of the body, and connected to the second lead part,
wherein an insulating layer is disposed on the further surface between the first and second plating electrodes and extending in a thickness direction to at least an outer surface of at least one of the first or second plating electrode in the thickness direction,
wherein a portion of the first plating electrode disposed on the first surface directly contacts a first magnetic metal particle among the magnetic metal particles and a portion of the first plating electrode disposed on the further surface is spaced apart from the magnetic metal particles, and
wherein a portion of the second plating electrode disposed on the second surface directly contacts a second magnetic metal particle, among the magnetic metal particles and a portion of the second plating electrode disposed on the further surface is spaced apart from the magnetic metal particles.

6 more elements

Dependencies are inferred from the claim text.

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Abstract

A coil electronic component comprising:

a body including a resin having dispersed therein magnetic metal particles;
a coil disposed in the body and having first and second lead parts respectively outwardly exposed to first and second surfaces of the body;
a first plating electrode disposed on at least a portion of the first surface of the body, including the resin having dispersed therein the magnetic metal particles, and on at least a portion of a further surface of the body connected to and extending from the first surface, and connected to the first lead part;
a second plating electrode disposed on at least a portion of the second surface of the body, including the resin having dispersed therein the magnetic metal particles, and on at least another portion of the further surface of the body connected to and extending from the second surface, and connected to the second lead part;
and
an insulating layer disposed on the further surface between the first and second plating electrodes and extending in a thickness direction to at least an outer surface of at least one of the first or second plating electrode in the thickness direction,
wherein each of the first and second plating electrodes comprises plural plating layers including a first plating layer that includes copper (Cu) and contacts the body and one of the first and second lead parts,
wherein a portion of the first plating electrode disposed on the first surface directly contacts a first magnetic metal particle among, the magnetic metal particles and a portion of the first plating electrode disposed on the further surface is spaced apart from the magnetic metal particles, and
wherein a portion of the second plating electrode disposed on the second surface directly contacts a second magnetic metal particle among the magnetic metal particles and a portion of the second plating electrode disposed on the further surface is spaced apart from the magnetic metal particles.

6 more elements