Coating material for forming conductive release layer, method for producing same, conductive release film, and method for producing same
AssigneeShin-Etsu Polymer Co., Ltd.
InventorsSou Matsubayashi, Kohei Kanto
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Abstract
Provided is a coating material for forming a conductive release layer capable of forming a conductive release layer having high adhesion to a film base material, suppressing deterioration in conductivity over time in the air, and having a sufficient releasing property. The coating material for forming a conductive release layer of the present invention contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a curable silicone, a polyester resin, and an organic solvent.
Claims21
A coating material for forming a conductive release layer comprising:
- a conductive composite including a π-conjugated conductive polymer and a polyanion;
- an epoxy compound having an epoxy group;
- a curable silicone;
- a polyester resin having a glass transition temperature between 40° C. and 90° C.;
- and
- an organic solvent,
- wherein the mass ratio of the polyester resin to the conductive composite is from 5.3 to 53.4, and the coating material is free of a surfactant as an additive.
A method for producing a coating material for forming a conductive release layer, the method comprising:
- adding an epoxy compound having an epoxy group to an aqueous dispersion comprising a conductive composite containing a π-conjugated conductive polymer and a polyanion in an aqueous dispersion medium;
- precipitating a conductive composite to obtain a precipitate;
- recovering the precipitate;
- and
- adding an organic solvent, a curable silicone, and a polyester resin having a glass transition temperature between 40° C. and 90° C. to the recovered precipitate to produce the coating material,
- wherein the mass ratio of the polyester resin to the conductive composite is from 5.3 to 53.4, and the coating material is free of a surfactant as an additive.
A conductive release film comprising:
- a film base material;
- and
- a conductive release layer formed from a coating material coated on at least one surface of the film base material,
- wherein the conductive release layer contains a conductive composite including a π-conjugated conductive polymer and a polyanion, an epoxy compound having an epoxy group, a silicone, and a polyester resin having a glass transition temperature between 40° C. and 90° C., the mass ratio of the polyester resin to the conductive composite is from 5.3 to 53.4, and the epoxy compound having an epoxy group is bonded to the anion group of a part of the polyanion.
Dependencies are inferred from the claim text.