Physical identifiers for authenticating an identity of a semiconductor component
AssigneeGoogle Inc.
InventorsAndy Yang, Scott D. Johnson, Lynn Bos, Neal Mueller
Life of this patent
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Abstract
This document describes techniques for authenticating an identity of a semiconductor component using a physical identifier. In some aspects, a physical identifier comprised of a region of features located indiscriminately within a surface of an encapsulated semiconductor component is fabricated. The physical identifier is then mapped. The map is then stored for use when authenticating the identity of the semiconductor component.
Claims20
A method for enabling authentication of an identity of a semiconductor component, the method comprising:
- fabricating, at a surface of the semiconductor component, a physical identifier, the physical identifier a region of features that are located indiscriminately at the surface of the semiconductor component;
- mapping the physical identifier, the map representing the region;
- encrypting the map as first digital data;
- reading, electrically from integrated circuitry of the semiconductor component, a binary identifier;
- encrypting the binary identifier as second digital data;
- and
- storing the map encrypted as the first digital data and the binary identifier encrypted as the second digital data to enable authentication of the identity of the semiconductor component.
A method for authenticating an identity of a semiconductor component, the method comprising:
- molding, into a surface of the semiconductor component, a physical identifier, the physical identifier a region of features that are located indiscriminately within the surface of the semiconductor component;
- mapping the physical identifier, the map a first map;
- reading, electrically from integrated circuitry of the semiconductor component, a binary identifier;
- retrieving a second map based on the read binary identifier;
- and
- authenticating the identity of the semiconductor component, the authenticating based on comparing the first map and the second map.
A semiconductor component comprising:
- a physical identifier having a region of features, the features located indiscriminately within a surface of the semiconductor component, molded by an encapsulation process into the surface of the semiconductor component, and capable of being mapped to a first map;
- and
- a binary identifier stored within integrated circuitry of the semiconductor component, the binary identifier capable of being electrically read and used to retrieve a second map to compare to the first map and authenticate an identity of the semiconductor component.
Dependencies are inferred from the claim text.