Intelligent dual inline memory module thermal controls for maximum uptime

A method, comprising:

• prior to a first DIMM failure of a first DIMM of a memory subsystem of a DIMM thermal control system being detected:
• scanning, by a basic input/output system (BIOS) of the memory subsystem, a first serial presence detect (SPD) module of the memory subsystem for a first failure events log, the first SPD module associated with the first DIMM;
• and
• when the first DIMM failure of the first DIMM is detected:
• recording, by a baseboard management controller (BMC) of the DIMM thermal control system, a first failure event in the first failure events log of the first SPD module, wherein the first failure event comprises the first DIMM failure and associated first thermal telemetry data of the first DIMM;
• adjusting, by the BMC, first DIMM thermal control settings to reduce a first temperature of the first DIMM based on the first failure events log including at least the first failure event;
• and
• adjusting, by the BMC, second DIMM thermal control settings to set a second temperature of a second DIMM based on the first failure events log including at least the first failure event.