Semiconductor device, display driver and display device
AssigneeRohm Co., Ltd.
InventorSukenori Ito
Life of this patent
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AssigneeRohm Co., Ltd.
InventorSukenori Ito
Estimating the term…
The present disclosure relates to evaluation of a mounted resistor formed between a bump and electrodes. A display device of the present disclosure includes a display panel formed in a transparent substrate and a display driver driving the display panel. A plurality of bumps is formed on a connection surface of the display driver. A plurality of electrodes is formed on the transparent substrate and corresponds in position to the plurality of bumps. COG mounting enables the bumps on the display driver side to electrically connect to the electrodes on the transparent substrate side. On the connection surface of the display driver, the bumps, which are for use in signal transmission, further include a first evaluation-oriented bump (TA[i]) and a second evaluation-oriented bump (TB[i]). Evaluation-oriented electrodes (EL[i]) are disposed on the transparent substrate and correspond in position to the first evaluation-oriented bump (TA[i]) and the second evaluation-oriented bump (TB[i]). Upon completion of COG mounting, a resistance value evaluation circuit (140a) disposed on the display driver generates evaluation signal (DET[i]) corresponding to resistance value (RA[i]+RB[i]) between the evaluation-oriented electrodes and the first and second evaluation-oriented bumps.
A semiconductor device, having a connection surface which a signal-oriented bump group is formed on, allowing signals to be sent to an object substrate through a signal-oriented electrode group on the object substrate and the signal-oriented bump group and the object substrate disposed opposite to the connection surface, the semiconductor device comprising:
Dependencies are inferred from the claim text.