Fingerprint sensor device and method
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsChen-Hua Yu, Yu-Feng Chen, Chih-Hua Chen, Hao-Yi Tsai, Chung-Shi Liu
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Abstract
A fingerprint sensor package and method are provided. The fingerprint sensor package comprises a fingerprint sensor along with a fingerprint sensor surface material and electrical connections from a first side of the fingerprint sensor to a second side of the fingerprint sensor. A high voltage chip is connected to the fingerprint sensor and then the fingerprint sensor package with the high voltage chip are connected to a substrate, wherein the substrate has an opening to accommodate the presence of the high voltage chip.
Claims20
A method comprising:
- attaching a fingerprint sensor to a first side of a first redistribution layer;
- attaching a high voltage chip to a second side of the first redistribution layer, wherein the second side of the first redistribution layer is opposite to the first side of the first redistribution layer;
- and
- attaching a substrate to the second side of the first redistribution layer, wherein the high voltage chip extends into an opening of the substrate.
A method comprising:
- forming a plurality of through vias in a fingerprint sensor substrate, the plurality of through vias extending from a first side of the fingerprint sensor substrate to a second side of the fingerprint sensor substrate, the first side of the fingerprint sensor substrate being opposite to the second side of the fingerprint sensor substrate;
- forming a first redistribution layer on the first side of the fingerprint sensor substrate;
- attaching a high voltage chip to the first redistribution layer, the first redistribution layer being interposed between the high voltage chip and the fingerprint sensor substrate;
- and
- attaching a second substrate to the first redistribution layer, the first redistribution layer being interposed between the second substrate and the fingerprint sensor substrate.
A method comprising:
- forming a plurality of first through vias and a plurality of second through vias in a fingerprint sensor substrate, the plurality of first through vias and the plurality of second through vias extending from a first side of the fingerprint sensor substrate to a second side of the fingerprint sensor substrate, the first side of the fingerprint sensor substrate being opposite to the second side of the fingerprint sensor substrate;
- forming an array of electrodes over the first side of the fingerprint sensor substrate;
- attaching a fingerprint sensor cover to the first side of the fingerprint sensor substrate, wherein the array of electrodes is interposed between the fingerprint sensor substrate and fingerprint sensor cover;
- attaching a high voltage chip to the second side of the fingerprint sensor substrate, wherein the high voltage chip is bonded to the plurality of first through vias;
- and
- attaching a second substrate to the second side of the fingerprint sensor substrate, wherein the second substrate is bonded to the plurality of second through vias.
Dependencies are inferred from the claim text.