Vias with multiconnection via structures

A system, comprising:

• one or more processors configured to:
• obtain layout information associated with an initial via in a circuit, the initial via comprising an initial lower metal enclosure and an initial upper metal enclosure connected by an initial cut;
• determine layout information associated with a multiconnection via structure comprising:
• a plurality of sibling vias having at least one additional upper metal enclosure and at least one additional lower metal enclosure, and the initial via;
• wherein:
• the plurality of sibling vias are connected by a plurality of corresponding sibling cuts;
• and
• the multiconnection via structure has lower resistance than the initial via structure;
• update the layout information associated with the initial via with the layout information associated with the multiconnection via structure comprising the plurality of sibling vias and the initial via;
• and
• output the updated layout information;
• and
• one or more memories coupled to the one or more processors and configured to provide the processors with instructions.

A computer program product, the computer program product being embodied in a tangible computer readable storage medium and comprising computer instructions for:

• obtaining layout information associated with an initial via in a circuit, the initial via comprising an initial lower metal enclosure and an initial upper metal enclosure connected by an initial cut;
• determining layout information associated with a multiconnection via structure comprising:
• a plurality of sibling vias having at least one additional upper metal enclosure and at least one additional lower metal enclosure, and the initial via;
• wherein:
• the plurality of sibling vias are connected by a plurality of corresponding sibling cuts;
• and
• the multiconnection via structure has lower resistance than the initial via structure;
• updating the layout information associated with the initial via with the layout information associated with the multiconnection via structure comprising the plurality of sibling vias and the initial via;
• and
• outputting the updated layout information.