Method of forming electrical contacts in layered structures
AssigneeCambrios Film Solutions Corporation
InventorsPaul Mansky, Kalpesh Biyani
Life of this patent
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Abstract
The present disclosure is directed to a method of forming a layered structure including a nanostructure layer having nanostructures. The method includes: forming a coating layer on the surface of the nanostructure layer, reflowing the coating layer, depositing one or more conductive plugs into the coating layer, and hardening the coating layer. The one or more conductive plugs each has a first portion configured to be placed in electrical communication with the nanostructure layer and a second portion not covered by the coating layer.
Claims16
A method of forming a layered structure, the method comprising:
- forming a coating layer on a surface of a nanostructure layer, wherein the nanostructure layer comprises a plurality of nanostructures;
- reflowing the coating layer to transform the coating layer from a first state having a first viscosity to a second state having a second viscosity greater than the first viscosity;
- depositing one or more conductive plugs in the coating layer while the coating layer is in the second state, the one or more conductive plugs each having a first portion configured to electrically contact the nanostructure layer and a second portion not covered by the coating layer;
- and
- hardening the coating layer, wherein the reflowing the coating layer comprises exposing the one or more conductive plugs to at least one of heat or a solvent prior to the depositing the one or more conductive plugs in the coating layer.
A method of forming a layered structure, the method comprising:
- forming a coating layer on a surface of a nanostructure layer, wherein the nanostructure layer comprises a plurality of nanostructures;
- coating one or more conductive plugs with a solvent configured to change a viscosity of the coating layer upon contact with the one or more conductive plugs;
- depositing the one or more conductive plugs in the coating layer after the coating the one or more conductive plugs with the solvent, the one or more conductive plugs each having a first portion configured to electrically contact the nanostructure layer and a second portion not covered by the coating layer;
- and
- hardening the coating layer.
Dependencies are inferred from the claim text.