Thin film transistor substrate having source and drain upper-layer electrodes
AssigneeMitsubishi Electric Corporation
InventorsKazunori Inoue, Koji Oda, Takafumi Hashiguchi, Takeshi Kubota
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AssigneeMitsubishi Electric Corporation
InventorsKazunori Inoue, Koji Oda, Takafumi Hashiguchi, Takeshi Kubota
Estimating the term…
An opening insulation film covers a substrate and is in contact with a side surface of a gate electrode. The opening insulation film is provided with a first opening portion having a side surface on the gate electrode. A gate insulation film made of an oxide insulator is on the gate electrode and the opening insulation film. A semiconductor channel film made of an oxide semiconductor is on the gate insulation film and is encompassed by the first opening portion. Source and drain electrodes are on the semiconductor channel film. A source upper-layer electrode and a drain upper-layer electrode both made of an oxide are provided at least on upper surfaces of the source electrode and the drain electrode, respectively. An interlayer insulation film made of an oxide has a portion provided on the source upper-layer electrode and the drain upper-layer electrode and is in contact the semiconductor channel film.
A thin film transistor substrate including a thin film transistor having a layered structure in which a first conductive layer, a first insulation layer, a second insulation layer made of an oxide insulator different from a material of the first insulation layer, an oxide semiconductor layer, a second conductive layer, a third conductive layer made of an oxide, and a third insulation layer made of an oxide are disposed on a substrate, the thin film transistor substrate comprising:
Dependencies are inferred from the claim text.