Substrate for electro-optical device, individual substrate, electro-optical device, electronic apparatus, and method for manufacturing substrate for electro-optical device

An individual substrate comprising:

• an internal circuit provided on a base material, the internal circuit including a peripheral circuit;
• a first coupling terminal arranged at a first side of the base material;
• a plurality of second coupling terminals arranged at a second side of the base material intersecting the first side;
• a plurality of third coupling terminals arranged at a third side of the individual substrate intersecting the first side and opposite to the second side;
• a first coupling wiring electrically coupling the internal circuit and the first coupling terminal;
• a first electrostatic protection circuit that is arranged between the first coupling terminal and the first side, and that is electrically coupled, on one end side thereof, to the first coupling terminal;
• and
• a second electrostatic protection circuit that is arranged at the second side of the base material, and that is electrically coupled, on one end side thereof, to the first coupling wiring, wherein
• the first coupling terminal is an external coupling terminal configured to couple to an image signal supply circuit,
• each of the second coupling terminals is an inspection terminal configured to inspect the internal circuit, and
• each of the third coupling terminals is an inspection terminal configured to inspect the internal circuit such that an input signal provided to the second coupling terminals corresponds to an output signal output by the third coupling terminals.

A method for manufacturing a substrate for an electro-optical device, the substrate including a plurality of individual substrates arranged in a first direction and a second direction intersecting the first direction,

• the individual substrate including an internal circuit, a plurality of first coupling terminals arranged at a first side of the individual substrate, a plurality of second coupling terminals arranged at a second side of the individual substrate intersecting the first side, and a plurality of third coupling terminals arranged at a third side of the individual substrate intersecting the first side and opposite to the second side, the internal circuit including a peripheral circuit,
• one end side of each of the plurality of first coupling terminals being electrically coupled, via a first electrostatic protection circuit, to a first common wiring extending along the first side, and another end side of each of the plurality of first coupling terminals being electrically coupled, via a first coupling wiring, to the internal circuit,
• the first coupling wiring being electrically coupled, via a second electrostatic protection circuit, to a second common wiring extending along the second side of the individual substrate,
• each of the first coupling terminals being an external coupling terminal configured to couple to an image signal supply circuit,
• each of the second coupling terminals being an inspection terminal configured to inspect the internal circuit, and
• each of the third coupling terminals being an inspection terminal configured to inspect the internal circuit such that an input signal provided to the second coupling terminals corresponds to an output signal output by the third coupling terminals, the method comprising:
• cutting the first electrostatic protection circuit along the second direction and cutting the second electrostatic protection circuit along the first direction to take out the individual substrate.