Semiconductor package, integrated optical communication system and manufacturing method of integrated optical communication system

An integrated optical communication system, comprising:

• a photonic integrated circuit comprises a coupling surface and a plurality of optical couplers disposed on the coupling surface and configured to be coupled to a plurality of optical fibers;
• at least one electronic integrated circuit disposed with the photonic integrated circuit in a side by side manner;
• an encapsulating material extending along sidewalls of the photonic integrated circuit and sidewalls of the at least one electronic integrated circuit to separate the photonic integrated circuit from the at least one electronic integrated circuit, wherein the encapsulating material reveals the plurality of optical couplers, and a back surface of the photonic integrated circuit and an active surface of the at least one electronic integrated circuit are substantially leveled with a top surface of the encapsulating material;
• and
• a redistribution structure being in contact with the top surface of the encapsulating material, the back surface of the photonic integrated circuit and the active surface of the at least one electronic integrated circuit, and located at a side opposite to the plurality of optical couplers, wherein the redistribution structure electrically connecting the photonic integrated circuit and the at least one electronic integrated circuit.

A manufacturing method of an integrated optical communication system, comprising:

• providing a photonic integrated circuit and at least one electronic integrated circuit on a carrier, wherein the photonic integrated circuit and the at least one electronic integrated circuit are disposed in a side by side manner, and the photonic integrated circuit comprises a plurality of optical couplers facing the carrier and covered by a protection film;
• providing an encapsulating material on the carrier for encapsulating the photonic integrated circuit and the at least one electronic integrated circuit;
• providing a redistribution structure over the encapsulating material, the photonic integrated circuit, and the at least one electronic integrated circuit, wherein the redistribution structure is electrically connected to the photonic integrated circuit and the at least one electronic integrated circuit;
• removing the carrier;
• removing the protection film for revealing the plurality of optical couplers;
• and
• performing a singularizing process to form a plurality of integrated optical communication systems.