Side-biased current sensor with improved dynamic range

A current sensor package, comprising:

• a sensor chip including a first magnetic sensing element and a second magnetic sensing element;
• a magnet that produces a magnetic field,
• wherein the magnet is arranged at a first distance from the first magnetic sensing element, and
• wherein the magnet is arranged at a second distance from the second magnetic sensing element,
• wherein the first distance is different from the second distance such that a strength of the magnetic field at the first magnetic sensing element is different from a strength of the magnetic field at the second magnetic sensing element;
• a fixation feature associated with positioning a current medium,
• wherein the fixation feature includes a hole or an opening in a material of the current sensor package,
• wherein the fixation feature is arranged in the current sensor package such that the current medium runs through a length of the hole or the opening in a first direction parallel to a first axis, and
• wherein an entirety of the sensor chip is arranged between the magnet and the fixation feature in a second direction parallel to a second axis,
• the second axis being perpendicular to the first axis;
• and
• a carrier including a substrate,
• wherein the magnet is directly attached to the substrate,
• wherein the sensor chip is directly attached to the substrate, and
• wherein the entirety of the sensor chip is arranged on a plane of the substrate, and
• wherein the plane of the substrate is parallel to a plane defined by the first direction and the second direction.

A sensor package, comprising:

• a sensor chip to measure an amount of electrical current in a current medium based on a magnetic field generated by the electrical current,
• the sensor chip including at least two magnetic sensing elements;
• a magnet that produces a bias magnetic field,
• wherein the magnet is arranged such that the magnet asymmetrically biases the at least two magnetic sensing elements;
• a fixation feature associated with positioning the current medium,
• wherein the fixation feature includes a hole or an opening in a material of the sensor package,
• wherein the fixation feature is arranged in the sensor package such that the current medium runs through a length of the hole or the opening in a first direction parallel to a first axis, and
• wherein an entirety of the magnet is arranged between the sensor chip and the fixation feature in a second direction parallel to a second axis,
• the second axis being perpendicular to the first axis;
• and
• a carrier including a substrate,
• wherein the magnet is directly attached to the substrate,
• wherein the sensor chip is directly attached to the substrate, and
• wherein an entirety of the sensor chip is arranged on a plane of the substrate, and
• wherein the plane of the substrate is parallel to a plane defined by the first direction and the second direction.