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US 10,852,080 B2Granted
Controllers, apparatuses, and methods for thermal management using adaptive thermal resistance and thermal capacity
AssigneeSamsung Electronics Co., Ltd.
InventorsYun-hyeok Im, Myung-kyoon Yim, Kyoung-min Lee, Kyung-soo Lee
Life of this patent
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Abstract
A controller configured to: acquire a temperature of a first component and a temperature of a second component; and adjust a thermal resistance of a medium between the first component and the second component based on the acquired temperature of the first component, the acquired temperature of the second component, a first temperature limit of the first component, and a second temperature limit of the second component.
Claims16
A controller configured to:
- acquire a first temperature of a first component and a second temperature of a second component, the first component configured to emit heat;
- estimate a first thermal margin of the first component based on a first temperature limit of the first component and the first temperature;
- estimate a second thermal margin of the second component based on a second temperature limit of the second component and the second temperature;
- and
- adjust a thermal resistance of a medium between the first component and the second component based on the first thermal margin, the second thermal margin, a first reference value of the first thermal margin, and a second reference value of the second thermal margin including at least one of
- decreasing the thermal resistance of the medium based on the first thermal margin being less than the first reference value and the second thermal margin being equal to or greater than the second reference value, or
- increasing the resistance of the medium based on the first thermal margin being equal to or greater than the first reference value and the second thermal margin being less than the second reference value.
4 more elements
A controller configured to:
- acquire a first temperature of a first component and a second temperature of a second component, the second component being thermally coupled to the first component and having a variable thermal capacity;
- and
- adjust the variable thermal capacity of the second component based on the first temperature, the second temperature, a first temperature limit of the first component, and a second temperature limit of the second component,
- wherein the controller is further configured to:
- estimate a temperature increase rate of the first component;
- and
- adjust the variable thermal capacity based on the temperature increase rate, the first temperature, the second temperature, the first temperature limit, and the second temperature limit.
4 more elements
An apparatus, comprising:
- a first component having a first temperature limit;
- a second component having a second temperature limit;
- a first medium between the first component and the second component, a thermal capacity of the second component being adjustable;
- and
- a controller configured to,
- estimate a first thermal margin of the first component based on the first temperature limit and a first temperature of the first component, and
- estimate a second thermal margin of the second component based on the second temperature limit and a second temperature of the second component, and
- adjust the thermal capacity of the second component based on the first thermal margin, the second thermal margin, a first reference value of the first thermal margin and a second reference value of the second thermal margin.
5 more elements
Dependencies are inferred from the claim text.