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US 10,851,267 B2Granted
Polishing composition
AssigneeFujimi Incorporated
InventorsYukinobu Yoshizaki, Youhei Takahashi
Life of this patent
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Abstract
Polishing compositions are disclosed which contribute to improvement of level difference performance (in particular, erosion). The polishing composition used for polishing an object to be polished includes abrasive grains and a dispersing medium, wherein the abrasive grains have an average primary particle size of 40 nm or less, and the number of coarse particles having a particle size of 0.2 to 1,600 μm in the abrasive grains is 20,000 or less per 1 cm3 of the polishing composition.
Claims14
A polishing composition used for polishing an object to be polished, comprising an abrasive grain and a dispersing medium,
- wherein the abrasive grain has an average primary particle size of 15 nm or less, and
- a number of coarse particles having a particle size of 0.2 to 1,600 μm in the abrasive grain is 20,000 or less per 1 cm3 of the polishing composition.
Dependencies are inferred from the claim text.