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US 10,851,261 B2Granted
Semiconductor-encapsulating epoxy resin composition and semiconductor device
AssigneeShin-Etsu Chemical Co., Ltd.
InventorsHiroki Oishi, Shoichi Osada, Ryuhei Yokota, Munenao Hirokami
Life of this patent
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Abstract
An epoxy resin composition comprising an epoxy resin, a curing agent, (A) a carboxyl-containing benzotriazole derivative, and (B) an alkoxysilyl-containing aminoalkylsilane derivative is suited for encapsulating semiconductor devices. The sum of (A)+(B) is 0.5-5.0 pbw per 100 pbw of the sum of the epoxy resin and the curing agent, and a molar ratio (A)/(B) is 0.5-1.5. The composition is free of sulfur and highly adhesive to metal substrates.
Claims6
An epoxy resin composition for semiconductor encapsulation comprising an epoxy resin and a curing agent as essential components,
- the composition further comprising (A) a benzotriazole derivative having at least one carboxyl group per molecule and (B) an aminoalkylsilane derivative having at least one alkoxysilyl group per molecule in such amounts that the sum of (A) and (B) is 0.5 to 5.0 parts by weight per 100 parts by weight of the sum of the epoxy resin and the curing agent, and a molar ratio (A)/(B) ranges from 0.5/1 to 1.5/1.
Dependencies are inferred from the claim text.