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US 10,851,232 B2Granted
Encapsulating composition, organic electronic device and method for manufacturing thereof
AssigneeLG Chem, Ltd.
InventorsKook Hyun Choi, Joon Hyung Kim, Yu Jin Woo, Mi Lim Yu
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Abstract
The present application relates to an encapsulating composition and an organic electronic device comprising the same, and provides an encapsulating composition which can effectively block moisture or oxygen introduced into an organic electronic device from the outside to secure the lifetime of the organic electronic device, is possible to realize a top emission type organic electronic device, is applicable to an inkjet method, can provide a thin display and has excellent adhesion reliability.
Claims19
An encapsulating composition comprising:
- 5 to 50 parts by weight of a curable compound having a cyclic structure in its molecular structure, and
- 25 to 80 parts by weight of a vinyl ether curable compound,
- wherein the curable compound having a cyclic structure does not comprise an vinyl ether group and an oxetane group.
Dependencies are inferred from the claim text.