Method for producing security elements having a lenticular flip
AssigneeOVD Kinegram AG
InventorsAndreas Schilling, Rene Staub, Philipp Schuler, Achim Hansen
Life of this patent
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Abstract
A method for producing a security element formed as a lenticular flip, including a micro-optical layer, a carrier substrate and an image layer, wherein the image layer includes n images for n=1 to i which are visible from an n-th observation angle allocated to the n-th image, and wherein n is at least 1. The images are imaged on a photoresist with parallel light in contact print or by means of projection. After the photoresist is developed, an image layer which includes the i images is present.
Claims44
A method for producing a security element comprising a micro-optical layer, wherein the micro-optical layer comprises an array formed from micro-optical systems, a carrier substrate and one image layer or several image layers, wherein the one image layer or several image layers comprises or comprise n partial images for n=1 to i which are visible from an n-th observation angle allocated to the n-th partial image, and wherein n is at least 1, and wherein the following method steps are provided:
- a) providing the carrier substrate, on the upper side of which the micro-optical layer is formed;
- b) applying a photoresist to the underside of the carrier substrate;
- c) forming a latent n-th partial image in the photoresist,
- wherein an n-th master image is projected onto the micro-optical layer with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth, or
- wherein the photoresist in step b) is applied in the form of an n-th master image to the underside of the carrier substrate and wherein the photoresist is exposed through the micro-optical layer with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth;
- d) repeating method step c) i−1 times until the i-th latent partial image is formed;
- e) developing the photoresist to form the image layer,
- wherein method steps b), c) and e) are performed with an n-th photoresist formed with an n-th color and/or an n-th sensitivity, and wherein method steps b), c) and e) are repeated (i−1) times, wherein i is at least 2.
A method for producing a security element comprising a micro-optical layer, wherein the micro-optical layer comprises an array formed from micro-optical systems, a carrier substrate and one image layer or several image layers, wherein the one image layer or several image layers comprises or comprise n partial images for n=1 to i which are visible from an n-th observation angle allocated to the n-th partial image, and wherein n is at least 1, and wherein the following method steps are provided:
- a) providing the carrier substrate, on the upper side of which the micro-optical layer is formed;
- b) applying a photoresist to the underside of the carrier substrate;
- c) forming a latent n-th partial image in the photoresist,
- wherein an n-th master image is placed on the micro-optical layer and is exposed with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth, or
- wherein an n-th master image is projected onto the micro-optical layer with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth, or
- wherein the photoresist in step b) is applied in the form of an n-th master image to the underside of the carrier substrate and wherein the photoresist is exposed through the micro-optical layer with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth;
- d) repeating method step c) i−1 times until the i-th latent partial image is formed;
- and
- e) developing the photoresist to form the image layer,
- wherein the micro-optical layer has two or more micro-optical systems with a longitudinal axis and a transverse axis arranged next to each other, wherein the longitudinal axes of the micro-optical systems are arranged at an x-azimuth to the long side of the carrier substrate.
A method for producing a security element comprising a micro-optical layer, wherein the micro-optical layer comprises an array formed from micro-optical systems, a carrier substrate and one image layer or several image layers, wherein the one image layer or several image layers comprises or comprise n partial images for n=1 to i which are visible from an n-th observation angle allocated to the n-th partial image, and wherein n is at least 1, and wherein the following method steps are provided:
- a) providing the carrier substrate, on the upper side of which the micro-optical layer is formed;
- b) applying a photoresist to the underside of the carrier substrate;
- c) forming a latent n-th partial image in the photoresist,
- wherein an n-th master image is placed on the micro-optical layer and is exposed with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth, or
- wherein an n-th master image is projected onto the micro-optical layer with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth, or
- wherein the photoresist in step b) is applied in the form of an n-th master image to the underside of the carrier substrate and wherein the photoresist is exposed through the micro-optical layer with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth;
- d) repeating method step c) i−1 times until the i-th latent partial image is formed;
- and
- e) developing the photoresist to form the image layer,
- wherein the micro-optical layer has two or more micro-optical systems arranged in an x-y grid, wherein the x-axis of the x-y grid is arranged at an x-azimuth to the long side of the carrier substrate and the y-axis is arranged at a y-azimuth to the short side of the carrier substrate.
A method for producing a security element comprising a micro-optical layer, wherein the micro-optical layer comprises an array formed from micro-optical systems, a carrier substrate and one image layer or several image layers, wherein the one image layer or several image layers comprises or comprise n partial images for n=1 to i which are visible from an n-th observation angle allocated to the n-th partial image, and wherein n is at least 1, and wherein the following method steps are provided:
- a) providing the carrier substrate, on the upper side of which the micro-optical layer is formed;
- b) applying a photoresist to the underside of the carrier substrate;
- c) forming a latent n-th partial image in the photoresist,
- wherein an n-th master image is placed on the micro-optical layer and is exposed with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth, or
- wherein an n-th master image is projected onto the micro-optical layer with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth, or
- wherein the photoresist in step b) is applied in the form of an n-th master image to the underside of the carrier substrate and wherein the photoresist is exposed through the micro-optical layer with parallel light beams incident at an n-th angle of incidence and an n-th incident azimuth;
- d) repeating method step c) i−1 times until the i-th latent partial image is formed;
- and
- e) developing the photoresist to form the image layer,
- wherein the micro-optical layer comprises an array formed from microlenses, and
- wherein the microlenses are formed with at least two different focal lengths, and
- wherein the image layer is formed from a first and a second image layer, wherein the first image layer has a first partial image and the second image layer has a second partial image wherein method step b) is performed with a first photoresist wherein, after method step c), method step e) is performed to form the first image layer, and wherein the following further method steps are performed:
- f) applying a semitransparent reflective layer to the first image layer;
- g) applying a second photoresist to the semitransparent reflective layer;
- h) temporarily embedding the micro-optical layer in a compensation medium formed with the optical refractive index of the micro-optical systems;
- i) exposing the second photoresist, wherein the first image layer forms an exposure mask;
- k) developing the second photoresist to form a second image layer, which is formed as an etching mask;
- l) etching the semitransparent reflective layer;
- m) removing the compensation medium.
Dependencies are inferred from the claim text.