Liquid ejecting head and liquid ejecting apparatus
AssigneeSeiko Epson Corporation
InventorIkuya Miyazawa
Life of this patent
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Abstract
A liquid ejecting head including a first substrate in which a drive element that ejects a liquid from a nozzle, and a first wire electrically coupled to the drive element are formed, a second substrate in which an opposing surface that opposes the first substrate is adhered to the first substrate with an adhesive agent, a second wire being formed in the second substrate, and a protrusion configured to elastically deform, the protrusion being formed between the first substrate and the second substrate and electrically coupling the first wire and the second wire to each other. In the liquid ejecting head, a swelling ratio of the protrusion is larger than a swelling ratio of the adhesive agent.
Claims5
A liquid ejecting head comprising:
- a first substrate in which a drive element that ejects a liquid from a nozzle, and a first wire electrically coupled to the drive element are formed;
- a second substrate in which an opposing surface that opposes the first substrate is adhered to the first substrate with an adhesive agent, a second wire being formed in the second substrate;
- and
- a protrusion configured to elastically deform, the protrusion being formed between the first substrate and the second substrate and electrically coupling the first wire and the second wire to each other, wherein
- a swelling ratio of the protrusion is larger than a swelling ratio of the adhesive agent.
Dependencies are inferred from the claim text.