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US 10,850,446 B2Granted
Three-dimensional (3D) printing with epoxy mold compound
AssigneeHewlett-Packard Development Company, L.P.
InventorsChien-Hua Chen, Qin Liu, Michael G. Monroe
Life of this patent
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Abstract
In a three-dimensional printing method example, an epoxy mold compound build material is applied. A fusing agent is selectively applied on at least a portion of the epoxy mold compound build material. The epoxy mold compound build material is exposed to energy, thereby fusing the portion of the epoxy mold compound build material in contact with the fusing agent to form a layer.
Claims19
A three-dimensional (3D) printing method, comprising:
- applying a one part thermal cure epoxy mold compound build material;
- selectively applying a fusing agent on at least a portion of the epoxy mold compound build material;
- and
- exposing the epoxy mold compound build material to energy, thereby fusing the portion of the epoxy mold compound build material in contact with the fusing agent to form a layer.
1 more element
A three-dimensional (3D) printing system, comprising:
- a supply containing a one part thermal cure epoxy mold compound build material;
- a build material distributor;
- a supply of a fusing agent;
- an inkjet applicator for selectively dispensing the fusing agent;
- a controller;
- and
- a non-transitory computer readable medium having stored thereon computer executable instructions to cause the controller to:
- utilize the build material distributor to dispense the epoxy mold compound build material;
- and
- utilize the inkjet applicator to selectively dispense the fusing agent to pattern a three-dimensional part layer.
7 more elements
Dependencies are inferred from the claim text.