Manufacturing method of semiconductor device and semiconductor manufacturing apparatus

A semiconductor manufacturing apparatus comprising:

• a rotatable first table configured to hold a processing object;
• a rotatable second table having an abrasive cloth and configured to polish the processing object with the abrasive cloth;
• an AE sensor configured to detect elastic waves generated from the processing object during polishing of the processing object;
• an elastic wave processor configured to:
• plot first elastic wave data, second elastic wave data, and third elastic wave data in a multidimensional feature space having at least three axes of respective feature amounts,
• the first elastic wave data being data collected when polishing of each of sample processing objects is finished with neither a scratch nor a crack,
• the second elastic wave data being data collected when the scratch occurs during polishing of each of the sample processing objects, the second elastic wave data being classified depending on degree of the scratch,
• the third elastic wave data being data collected when the crack occurs during polishing of each of the sample processing objects, the third elastic wave data being classified depending on degree of the crack;
• categorize the first to third elastic wave data plotted in the multidimensional feature space into a normal polishing mode, plural degrees of scratch fault modes, and plural degrees of crack fault modes;
• plot fourth elastic wave data collected concurrently with polishing of a target processing object in the multidimensional feature space;
• and
• perform a pattern recognition to thereby analyze whether the fourth elastic wave data corresponds to either one of the normal polishing mode, the plural degrees of scratch fault modes and the plural degrees of crack fault modes concurrently with polishing of a target processing object in the multidimensional feature space;
• and
• a control computer configured to control the rotatable first table and the rotatable second table based on an analysis result provided by the elastic wave processor.