Teaching device and teaching method

A teaching method for performing teaching work at a cleaning unit having a plurality of cleaning modules of a wafer polishing device, the teaching method comprising the steps of:

• for each cleaning module having a stage on which the wafer is placed,
• receiving, a position signal from a dummy-wafer-side position sensor that is attached to a dummy wafer placed on the stage, to determine a position coordinate of the dummy-wafer-side position sensor based on the position signal from the dummy-wafer-side position sensor;
• receiving a position signal from an arm-side position sensor attached to a pair of openable/closable arms configured to hold the wafer, to determine a position coordinate of the arm-side position sensor based on the position signal from the arm-side position sensor;
• based on the position coordinate of the dummy-wafer-side position sensor, calculating a position coordinate of the arm-side position sensor when the pair of arms hold the wafer;
• moving, by a control part configured to control an operation of an arm-moving mechanism, the pair of arms to a standby position adjacent to a casing of the cleaning module;
• and
• moving the pair of arms such that the arm-side position sensor moves to the calculated position coordinate, while checking the position coordinate, of the arm-side position sensor, that is determined from the taosition signal of the arm-side nosition sensor.

A cleaning device for performing teaching work at a cleaning unit having a plurality of cleaning modules of a wafer polishing device, the cleaning device comprising:

• a stage provided in each cleaning module and on which a wafer is placed;
• a cleaning mechanism configured to clean the water on the stage;
• a pair of openable/closable arms configured to hold the wafer;
• an arm-moving mechanism configured to move the pair of arms with respect to the stage;
• a control part configured to control an operation of the arm-moving mechanism;
• an arm-side position sensor attached to the pair of arms and configured to transmit a position signal;
• a dummy wafer placed on the stage;
• a dummy-wafer-side position sensor attached to the dummy wafer and configured to transmit a position signal;
• and
• a signal receiver configured to receive the position signal from the arm-side position sensor to determine a position coordinate of the arm-side position sensor based on the position signal from the arm-side position sensor, and receive the position signal from the dummy-wafer-side position sensor to determine a position coordinate of the dummy-wafer-side position sensor based on the position signal from the dummy-wafer- side position sensor, wherein
• for each cleaning module, the control part, based on the position coordinate of the dummy-wafer-side position sensor, calculates a position coordinate of the arm-side position sensor when the pair of arms hold the wafer, and controls the operation of the arm-moving mechanism to move the pair of arms to a standby position adjacent to a casing of the cleaning module and to move the pair of arms such that the arm-side position sensor moves to the calculated position coordinate, while checking the position coordinate, of the arm-side position sensor, that is determined from the position signal of the arm-side position sensor.

A non-transitory storage medium configured to store a program for performing teaching work at a cleaning unit having a plurality of cleaning modules of a wafer polishing device, the program causing a computer to execute the steps of:

• for each cleaning module having a stage on which a wafer is placed, receiving a position signal from a dummy-wafer-side position sensor that is attached to a dummy wafer placed on the stage, to determine a position coordinate of the dummy-wafer-side position sensor based on the position signal from the dummy-wafer-side position sensor;
• receiving a position signal from an arm-side position sensor attached to the pair of openable/closable arms configured to hold the wafer, to determine a position coordinate of the arm-side position sensor based on the position signal from the arm-side position sensor;
• based on the position coordinate of the dummy-wafer-side position sensor, calculating a position coordinate of the arm-side position sensor when the pair of arms hold the wafer;
• moving, by a control part configured to control an operation of an arm-moving mechanism, the pair of arms to a standby position adjacent to a casing of the cleaning module;
• and
• moving the pair of arms such that the arm-side position sensor moves to the calculated position coordinate, while checking the position coordinate, of the arm-side position sensor. that is determined from the position signal of the arm-side position sensor.