Base material for printed circuit board and printed circuit board
AssigneesSumitomo Electric Industries, Ltd., Sumitomo Electric Printed Circuits, Inc.
InventorsKazuhiro Miyata, Takashi Kasuga, Yoshio Oka, Hiroshi Ueda
Life of this patent
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Abstract
A base material for a printed circuit board includes: an insulating base film; a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles; an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film; and an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer, wherein an arithmetic mean height Sa of the surface of the electroless plating layer opposite to the sintered layer is greater than or equal to 0.001 μm and less than or equal to 0.5 μm.
Claims7
A base material for a printed circuit board comprising:
- an insulating base film;
- a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles;
- an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film;
- and
- an electroplating, layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer,
- wherein an arithmetic mean height Sa of the surface of the electroless plating layer on which the electroplating layer is layered and at which the electroless plating layer is in contact with the electroplating layer is greater than or equal to 0.001 μm and less than or equal to 0.5 μm.
The base material for a printed circuit board according to claim wherein the arithmetic mean height Sa is less than or equal to 0.20 μm.
A printed circuit board comprising:
- an insulating base film;
- a sintered layer that is layered on at least one side surface of the base film and that is formed of a plurality of sintered metal particles;
- an electroless plating layer that is layered on a surface of the sintered layer that is opposite to the base film;
- an electroplating layer that is layered on a surface of the electroless plating layer that is opposite to the sintered layer,
- wherein the sintered layer, the electroless plating layer, and the electroplating layer are patterned in plan view, and
- wherein an arithmetic mean height Sa of the surface of the electroless plating layer on which the electroplating layer is layered and at which the electroless plating layer is in contact with the electroplating layer is greater than or equal to 0.001 μm and less than or equal to 0.5 μm.
Dependencies are inferred from the claim text.