Method for shielding system-in-package assemblies from electromagnetic interference
AssigneeHenkel IP & Holding GmbH
InventorsXuan Hong, Daniel Maslyk, Qizhuo Zhuo, Juliet Grace Sanchez
Life of this patent
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Abstract
A method for shielding a system-in-package (SIP) assembly from electromagnetic interference (EMI) includes laminating a pre-form EMI shielding film onto the assembly in a single lamination process. The EMI shielding film may be moldable in a vacuum lamination process to cover the SIP assembly and to substantially fill trenches formed in the assembly between adjacent component modules. The SIP assembly is accordingly shielded from EMI through the application of a single EMI shielding film.
Claims16
A method for shielding a system in package assembly from electromagnetic interference, wherein said system in package assembly includes a substrate, a plurality of component modules mounted on the substrate, with each component module including one or more components, an insulator covering the components on the substrate, and a trench formed in the insulator between adjacent component modules, wherein the trench has a maximum width of between 10-100 μm, said method comprising:
- providing a self-supporting EMI shielding film pre-form having a tensile modulus of less than 1 GPa at between 20-250° C.;
- vacuum laminating said self-supporting EMI shielding film pre-form against an exterior surface of the insulator and into the trench to form a coating in the trench and covering the exterior surface of the insulator;
- and
- curing said coating to a tensile modulus of at least 50 MPa.
A method for forming a system in package assembly, comprising:
- providing a substrate having an electrically conductive ground plane spaced from an active surface of said substrate, and an electrically conductive trace extending from said ground plane to said active surface;
- mounting a plurality of component modules at said active surface of said substrate to form an assembled surface of said substrate, wherein each component module includes one or more components;
- encapsulating said assembled surface of said substrate in a dielectric layer, wherein said dielectric layer extends between said assembled surface and an exterior surface;
- forming a trench between adjacent component modules and through said dielectric layer to said trace, said trench having a maximum width of between 10-100 μm;
- vacuum laminating a self-supporting EMI shielding film pre-form against the exterior surface of said dielectric layer and into the trench to form a coating in the trench contacting said trace and covering the exterior surface of the dielectric layer, said self-supporting EMI shielding film pre-form having a tensile modulus of less than 1 GPa at between 20-250° C.
Dependencies are inferred from the claim text.