Inverter device having heat dissipation mechanism

An inverter device having a heat dissipation mechanism, characterized in that the inverter device comprising:

• a casing comprising a base and a cover covering on the base, an internal surface and an external surface being oppositely defined on the cover, and the internal surface being arranged corresponding to the base;
• at least one heat source element accommodated in the casing and arranged on the base;
• a heat dissipation structure thermally contacted with the internal surface;
• at least one fan accommodated in the casing and arranged corresponding to the heat dissipation structure;
• and
• an air shroud is disposed between the internal surface and the base for covering the heat dissipation structure, two openings are defined on two opposite sides of the air shroud, and the fan is arranged corresponding to one of the openings;
• wherein a bottom wall and a lateral wall surrounding the bottom wall are defined on the base, the heat source element is arranged on the bottom wall, the internal surface is arranged corresponding to the bottom wall, a plurality of aiding fins is connected to an external side of the bottom wall, the number of the at least one heat source element is plural, the plurality of heat source elements comprise at least one circuit board, a power semiconductor component and a relay.