Cooling methods for electronic components
AssigneeInternational Business Machines Corporation
InventorsAaron R. Cox, William J. Grady, IV, Jason A. Matteson, Jason E. Minyard
Life of this patent
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Abstract
A method and apparatus for conveying heat away from an electronic component. The apparatus may include, a conformable thermal interface sleeve adapted to embrace the electronic component. The apparatus may further include, a heat conducting wedge adapted to contact the conformable thermal interface sleeve and a thermal channel adapted to contact the heat conducting wedge. The apparatus may also include a manifold adapted to contact the thermal channel.
Claims16
A method for conveying heat away from a circuit board having at least one integrated circuit mounted thereon, the method comprising:
- installing a connector of the circuit board into a receptacle;
- and
- fitting a conformable thermal interface sleeve over the circuit board by inserting the circuit board through an opening to an interior portion of the conformable thermal interface sleeve such that the interior portion embraces both a first side surface of the circuit board and a second side surface of the circuit board,
- wherein, after the conformable thermal interface sleeve is fitted over the circuit board and the circuit board is installed, heat generated by the at least one integrated circuit of the circuit board during use is conducted away from the circuit board through the conformable thermal interface sleeve.
A method for removing heat generated by a circuit board having at least one integrated circuit mounted thereon, wherein a conformable thermal interface sleeve is fitted over the circuit board such that an interior portion of the conformable thermal interface sleeve embraces both a first side surface of the circuit board and a second side surface of the circuit board, the method comprising:
- conducting the heat generated by the at least one integrated circuit of the circuit board, over which the conformable thermal interface sleeve is fitted, away from the circuit board through the conformable thermal interface sleeve.
A method for conveying heat away from an electronic component, the method comprising:
- installing a connector of the electronic component into a receptacle;
- and
- fitting a conformable thermal interface sleeve over the electronic component by inserting the electronic component through an opening to an interior portion of the conformable thermal interface sleeve such that the interior portion embraces both a first side surface of the electronic component and a second side surface of the electronic component,
- wherein, after the conformable thermal interface sleeve is fitted over the electronic component and the electronic component is installed, heat generated by the electronic component during use is conducted away from the electronic component through the conformable thermal interface sleeve,
- wherein a memory module extends outwardly from a portion of the first side surface of the electronic component, and wherein a first contact surface of the interior portion of the conformable thermal interface sleeve elastically conforms around the memory module and embraces substantially the entire first side surface once the electronic component is inserted through the opening to the interior portion of the conformable thermal interface sleeve.
Dependencies are inferred from the claim text.