Barrier for hybrid socket movement reduction
AssigneeInternational Business Machines Corporation
InventorsTheron Lee Lewis, Timothy Jennings, Timothy Younger, David Braun, John R. Dangler, Jennifer I. Bennett, James Bielick, Stephen Hugo
Life of this patent
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Abstract
Aspects of the invention include an apparatus to aid a surface mount connection process including a barrier, a substrate in a facing spaced relationship with the barrier, a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, and at least one fastening mechanism securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket.
Claims20
An apparatus to aid a surface mount connection process, the apparatus comprising:
- a barrier;
- a substrate in a facing spaced relationship with the barrier;
- a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, the hybrid LGA socket comprising a first surface and a second surface opposite the first surface, wherein the first surface comprises socket contact pads and the second surface comprising socket contact posts;
- and
- at least one fastening mechanism securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket,
- wherein the barrier is directly connected to the substrate through the at least one fastening mechanism and not through the hybrid LGA socket.
A method of surface mount connecting a hybrid land grid array (LGA) socket to a substrate, the method comprising:
- applying connecting material onto a substrate contact pad of the substrate;
- placing the hybrid LGA socket onto the substrate such that a socket contact pad of the hybrid LGA socket aligns with the substrate contact pad, the hybrid LGA socket comprising a first surface and a second surface opposite the first surface, wherein the first surface comprises socket contact pads and the second surface comprising socket contact posts;
- attaching a barrier to the substrate using at least one fastening mechanism, the substrate being in a facing spaced relationship with the barrier and the hybrid LGA socket being interposed between the barrier and the substrate;
- and
- adjusting and securing the barrier to the substrate at a selected distance such that a gap is formed between the barrier and the hybrid LGA socket,
- wherein the barrier is directly connected to the substrate through the at least one fastening mechanism and not through the hybrid LGA socket.
A barrier to aid a surface mount connection process,
- the barrier comprising:
- a first side;
- a second side opposite the first side;
- one or more orifices extending from the first side to the second side;
- and
- at least one fastening mechanism operable to secure the barrier to a substrate at a selected distance such that a gap is formed between the barrier and a hybrid land grid array (LGA) socket interposed between the barrier and the substrate, the hybrid LGA socket comprising a first surface and a second surface opposite the first surface, wherein the first surface comprises socket contact pads and the second surface comprising socket contact posts,
- wherein the barrier is configured to directly connect to the substrate through the at least one fastening mechanism and not through the hybrid LGA socket.
Dependencies are inferred from the claim text.