Component carrier with alternatingly vertically stacked layer structures of different electric density

A method of manufacturing a component carrier, the method comprising:

• providing a plurality of low density layer structures;
• providing a plurality of high density layer structures having a higher density of electrically conductive structures than the plurality of low density layer structures,
• wherein a criterion indicative of the density of electrically conductive structures is a number of electrically conductive components per unit of volume of the respective low density layer structure or high density layer structure;
• alternatingly vertically stacking the low density layer structures and the high density layer structures so that at least one low density layer structure is vertically arranged in-between two high density layer structures;
• and
• providing a vertical electrical connection between the low density layer structures and the high density layer structures;
• wherein the high density layer structures are configured to enable a sequential fan-out of a component mounted on the component carrier or embedded in the component carrier.