Creating in-via routing with a light pipe
AssigneeInternational Business Machines Corporation
InventorsMark J. Jeanson, Darryl Becker, Gerald Bartley, Matthew S. Doyle
Life of this patent
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Abstract
Creating in-via routing with a light pipe is disclosed. A resist layer is applied over a layer of conductive material provided in a via. A light pipe is inserted into the via. The surface of the light pipe includes at least one masked portion and at least one unmasked portion. A portion of the resist layer is exposed with light emitted from the unmasked portions of the light pipe. Portions of the conductive layer corresponding to the exposed portion of the resist layer are then removed to create the in-via routing.
Claims7
A method of creating in-via routing with a light pipe, the method comprising:
- applying a resist layer over a layer of conductive material provided in a via of a printed circuit board (PCB) comprising a plurality of PCB layers;
- inserting the light pipe into the via, wherein the surface of the light pipe includes at least one masked portion and at least one unmasked portion;
- exposing a portion of the resist layer with light emitted from the at least one unmasked portion of the light pipe;
- and
- removing a portion of the conductive layer corresponding to the exposed portion of the resist layer, wherein removing the portion of the conductor layer removes an electrical connection between at least two of the plurality of PCB layers, while intersecting at least two conductive traces.
Dependencies are inferred from the claim text.