Creating inductors, resistors, capacitors and other structures in printed circuit board vias with light pipe technology
AssigneeInternational Business Machines Corporation
InventorsGerald Bartley, Darryl Becker, Matthew Doyle, Mark Jeanson
Life of this patent
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Abstract
A method for forming passive electrical devices that includes depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board; inserting a light pipe having a mask configured to provide a passive electronic device geometry within the via to an entire depth of the via; and exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having the passive electronic device geometry on the sidewall of the via.
Claims20
A method for forming a passive electrical device comprising:
- depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board;
- inserting a light pipe having a mask, the mask configured to provide a passive electrical device geometry, within the via to an entire depth of the via;
- and
- exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having said passive electrical device geometry on the sidewall of the via.
A method for forming a passive electrical device comprising:
- depositing a photo reactive layer over a sidewall of a via that extends through a printed circuit board;
- inserting a light pipe having a mask, the mask configured to provide a passive electrical device geometry within the via to an entire depth of the via, wherein the mask on the light pipe has a first coil geometry that extends along an entire length of the light pipe that is inserted into the entire depth of the via;
- and
- exposing the photo reactive layer to radiation provided by the light pipe to provide a pattern having said passive electrical device geometry on the sidewall of the via, wherein the passive electrical device has a first coil inductor structure defined by the geometry provided by the mask of the light pipe;
- and
- depositing a first dielectric fill in the via after forming the first coil inductor structure.
A method for forming a passive electrical device comprising:
- forming conductive material over a sidewall of a via that extends through a printed circuit board;
- depositing a photo reactive layer over the conductive material along the sidewall of the via;
- inserting a light pipe having a mask, the mask configured to provide a passive electrical device geometry, within the via;
- and
- exposing the photo reactive layer to radiation passed through the light pipe to create a pattern having said passive electrical device geometry defined by the mask of the light pipe on the sidewall of the via.
Dependencies are inferred from the claim text.