System for potting components using a cap

A method for encapsulating at least one component in a housing assembly, comprising:

• providing a housing assembly that includes a housing with an opening and a printed circuit board (PCB) disposed in the housing, wherein the PCB includes the at least one component positioned with respect to the PCB and wherein the PCB has a surface, the at least one component including an upper portion extending a distance away from the surface of the PCB;
• installing a cap over the at least one component, wherein the cap includes an interior defined by a wall and a cover, the at least one component being disposed in the interior of the cap;
• after installing the cap, applying a predetermined vacuum to the housing assembly;
• after applying the vacuum, introducing an encapsulant through the opening of the housing so as to fill the housing to a predetermined potting level, wherein a portion of the interior of the cap remains at a pressure level established by the vacuum;
• releasing the vacuum to subject the housing assembly to atmospheric pressure, wherein a pressure differential between atmospheric pressure and a remainder vacuum in the interior of the cap causes encapsulant to flow from the housing upwardly into the interior of the cap to encapsulate the upper portion of the at least one component while a level of encapsulant outside the cap simultaneously decreases;
• and
• curing the encapsulant.