Electronic circuit module

An electronic circuit module comprising:

• a multilayer circuit board including a first principal surface on which a first electrode is provided, a second principal surface on which second electrodes including a grounding electrode are provided, a side surface connecting the first principal surface and the second principal surface, and internal conductors including a via conductor and a pattern conductor;
• an electronic component connected to the first electrode;
• a burying layer provided on the first principal surface of the circuit board with the electronic component buried therein;
• and
• a conductive film connected to the grounding electrode by the via conductor and the pattern conductor;
• wherein
• an outer surface of the burying layer includes a marking including a protruding shape that protrudes with respect to an outer surface of the burying layer, and the conductive film completely covers the marking and the outer surface of the burying layer;
• and
• the circuit board is made of a matrix including a glass fiber enforced insulating resin material or a ceramic material.