Wiring board
AssigneeNgk Spark Plug Co., Ltd.
InventorsTakakuni Nasu, Kengo Tanimori, Yousuke Kondo, Masahiro Kamegai, Kouta Kimata, Junya Matsura, Fumio Shiraki, Guangzhu Jin
Life of this patent
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Abstract
A wiring board includes: an insulator layer composed mainly of ceramic; a conductor extending through the insulator layer in a thickness direction thereof; and an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor, wherein: the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof; and each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer.
Claims4
A wiring board comprising:
- an insulator layer composed mainly of ceramic;
- a conductor extending through the insulator layer in a thickness direction thereof;
- and
- an electrode pad disposed on a first surface of the insulator layer and connected electrically with the conductor,
- wherein:
- the electrode pad includes through holes extending through the electrode pad in a thickness direction thereof;
- each of the through holes is positioned to avoid overlapping with the conductor in the thickness direction of the insulator layer;
- the through holes are arranged at intervals between 10 μm and 25 μm;
- the insulator layer includes a void exposed on the first surface of the insulator layer;
- and
- one of the through holes is formed to overlap with the void, as viewed in the thickness direction of the insulator layer.
Dependencies are inferred from the claim text.