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US 10,834,817 B2Granted
Plated opening with vent path
AssigneeNXP USA, Inc.
InventorsMichael B. Vincent, Zhiwei Gong, Scott M. Hayes
Life of this patent
Estimating the term…
Abstract
A plated hole with a sidewall plating. The plated hole has a vent opening that has a sidewall of non-conductive material that is not plated. During attachment of a joint conductive material such as solder to the sidewall plating, gasses generated from the attachment process are outgassed through the vent opening.
Claims9
An electronic component assembly comprising:
- an electronic component;
- a workpiece including an opening extending from a first major surface of the workpiece, the opening including an opening sidewall of non-conductive material;
- a sidewall plating, the sidewall plating covers a first portion of the opening sidewall of the non-conductive material in a plane parallel to the first major surface, a second portion of the opening sidewall in the plane is not covered by the sidewall plating;
- a conductive structure electrically coupled to the sidewall plating with a conductive joint material structure attached to the sidewall plating and to the conductive structure, wherein at least a portion of the conductive joint material structure is located in the opening and attached to the sidewall plating in the opening including in the plane, wherein the conductive joint material structure is not attached to the second portion of the opening sidewall in the plane.
1 more element
Dependencies are inferred from the claim text.