Implementing reworkable strain relief packaging structure for electronic component interconnects

A method for implementing enhanced reworkable strain relief packaging for electronic component interconnects, the method comprising:

• providing a BGA component;
• providing a component carrier;
• providing, at corner locations corresponding to corners of a placed BGA component on the component carrier, a plurality of first custom corner pads, and further providing on the component carrier, a ball grid array (BGA) module footprint, the BGA module footprint positioned within the plurality of first custom corner pads;
• providing, at locations on the BGA component corresponding to the corner locations, a plurality of second custom corner pads;
• applying a solder mask around the plurality of first custom corner pads and around the plurality of second custom corner pads, the solder mask providing a first constrained area and a second constrained area, respectively;
• depositing a fusible layer onto the plurality of first and the plurality of second custom corner pads, the fusible layer selected to have a melting temperature less than a melting temperature of solder used in BGA component solder joints formed between the BGA component and the component carrier;
• placing a solder paste onto BGA ball attach pads included in the BGA module footprint;
• placing the BGA component onto the component carrier so that solder attach balls of the BGA component contact the solder paste on the BGA ball attach pads;
• soldering the BGA component to the component carrier;
• and
• depositing a structural adhesive material onto the plurality of first and onto the plurality of second custom corner pads.