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US 10,834,809 B2Granted
Optoelectronic assembly, and method for producing an optoelectronic assembly
AssigneeLedvance GmbH
InventorGeorg Rosenbauer
Life of this patent
Estimating the term…
Abstract
An optoelectronic assembly is provided in different embodiments. The optoelectronic assembly has the following; a printed circuit board; at least one optoelectronic first component which is arranged on a first face of the printed circuit board; a heat sink which has a first surface that is arranged on a second printed circuit board face facing away from the first component, wherein a boundary surface extends between the second face and the first surface; and at least one first welding connection, by means of which the heat sink is directly connected to the printed circuit board in a bonded manner and which together with the boundary surface forms a first cut surface, the first component at least partly overlapping the cut surface.
Claims20
An optoelectronic assembly comprising:
- a printed circuit board;
- at least one first optoelectronic component arranged on a first side of the printed circuit board;
- and
- a heat sink comprising a first surface arranged on a second side of the printed circuit board, wherein the second side faces away from the at least one first optoelectronic component;
- wherein the heat sink is connected directly to the printed circuit board by at least one first weld connection that forms a first intersecting surface which extends through the second side of the printed circuit board and the first surface of the heat sink;
- and
- wherein the at least one first optoelectronic component at least partially overlaps the first intersecting surface such that an active layer of the at least one first optoelectronic component and the first intersecting surface at least partially overlap.
4 more elements
An optoelectronic assembly comprising:
- a printed circuit board;
- at least one first optoelectronic component arranged on a first side of the printed circuit board;
- and
- a heat sink comprising a first surface arranged on a second side of the printed circuit board facing away from the at least one first optoelectronic component;
- wherein the heat sink is connected directly to the printed circuit board by at least one first weld connection that forms a first intersecting surface which extends through the second side of the printed circuit board and the first surface of the heat sink;
- wherein the at least one first optoelectronic component at least partially overlaps the first intersecting surface such that an active layer of the at least one first optoelectronic component and the first intersecting surface at least partially overlap;
- wherein the at least one first weld connection, in a direction parallel to an interface of the second side of the printed circuit board and the first surface of the heat sink, is formed circular;
- and
- wherein the heat sink is further connected directly to the printed circuit board by at least one second weld connection that forms a second intersecting surface which extends through the second side of the printed circuit board and the first surface of the heat sink and which is formed concentrically to the at least one first weld connection.
6 more elements
A method for producing an optoelectronic assembly, the method comprising:
- providing a printed circuit board;
- providing at least one first optoelectronic component arranged on a first side of the printed circuit board;
- arranging a first surface of a heat sink on a second side of the printed circuit board facing away from the first side;
- and
- connecting the printed circuit board directly to the heat sink by at least one first weld connection, wherein the at least one first weld connection is formed via a laser beam radiated from outside the optoelectronic assembly onto a second surface of the heat sink facing away from the printed circuit board such that the at least one first weld connection forms a first intersecting surface which extends through the second side of the printed circuit board and the first surface of the heat sink, and wherein the at least one first optoelectronic component at least partially overlaps the first intersecting surface such that an active layer of the at least one first optoelectronic component and the first intersecting surface at least partially overlap.
2 more elements
An optoelectronic assembly comprising:
- a printed circuit board;
- at least one first optoelectronic component arranged on a first side of the printed circuit board;
- and
- a heat sink comprising a first surface arranged on a second side of the printed circuit board facing away from the at least one first optoelectronic component;
- wherein the heat sink is connected directly to the printed circuit board by at least one first weld connection that forms a first intersecting surface which extends through the second side of the printed circuit board and the first surface of the heat sink;
- wherein the at least one first optoelectronic component at least partially overlaps the first intersecting surface such that an active layer of the at least one first optoelectronic component and the first intersecting surface at least partially overlap;
- wherein the at least one first weld connection, in a direction parallel to an interface of the second side of the printed circuit board and the first surface of the heat sink, is formed rectilinear;
- and
- wherein the heat sink is further connected directly to the printed circuit board by at least one second weld connection that forms a second intersecting surface which extends through the second side of the printed circuit board and the first surface of the heat sink and which is formed parallel to the at least one first weld connection.
6 more elements
Dependencies are inferred from the claim text.