Microphone module, electronic device
AssigneeBeijing Xiaomi Mobile Software Co., Ltd.
InventorsChiafu Yen, Hui Du
Life of this patent
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Abstract
The present disclosure provides a microphone module, an electronic device, and relates to the field of electronic device technology. The microphone module includes a housing, a circuit board, a signal converter, and an adhesive member. The housing is formed with a cavity and an acoustic receiving hole which are connected with each other; the circuit board is connected to the housing to seal a bottom of the cavity; the adhesive member is provided in the cavity; the signal converter for converting an acoustic signal into an electrical signal is electrically connected to the circuit board and provided in the cavity.
Claims14
A microphone module, comprising:
- a housing, formed with a cavity and an acoustic receiving hole which are connected with each other;
- a circuit board connected to the housing to seal a bottom of the cavity;
- an adhesive member provided in the cavity;
- and
- a signal converter provided in the cavity and configured to convert an acoustic signal into an electrical signal,
- wherein the adhesive member comprises a first adhesive member that is attached to an inner wall of the housing and contacts only the inner wall of the housing, and
- wherein the first adhesive member extends from the cavity to the acoustic receiving hole and is attached to a side wall of the acoustic receiving hole.
Dependencies are inferred from the claim text.