Electronic device mainboard with audio processing function
AssigneesBeijing Xiaomi Mobile Software Co., Ltd., Shanghai Imilab Technology Co., Ltd.
InventorsShoufeng Huang, Wang Liu, Hesong Wang, Li Zhang
Life of this patent
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Abstract
An electronic device mainboard includes a main body; an audio collecting component provided on the main body and configured to collect audio; a main controlling component provided on the main body, connected with the audio collecting component through a printed circuit printed on the main body and configured to receive and analyze the audio and then send out interaction instructions according to the audio; and an interaction component provided on the main body, connected with the main controlling component and configured to receive and execute the interaction instructions.
Claims9
An electronic device, comprising a shell, a touch panel assembled on the shell and an electronic device mainboard assembled in the shell, wherein the touch panel is provided with a sound receiving hole, and a size of the electronic device mainboard matches a size of the touch panel, wherein, the electronic device mainboard comprises:
- a main body;
- an audio collecting component provided on the main body and configured to collect audio;
- a main controlling component provided on the main body, connected with the audio collecting component through a printed circuit printed on the main body and configured to receive and analyze the audio and then send interaction instructions according to the audio;
- and
- an interaction component provided on the main body, connected with the main controlling component and configured to receive and execute the interaction instructions;
- and
- wherein, the audio collecting component corresponds to the sound receiving hole.
Dependencies are inferred from the claim text.