Reconfigurable MEMS devices, methods of forming reconfigurable MEMS devices, and methods for reconfiguring frequencies of a MEMS device

A method for forming a microelectromechanical system (MEMS) device, comprising:

• providing an active layer having a first surface and a second surface;
• arranging a first electrode and a second electrode over the first surface of the active layer;
• arranging at least one reconfigurable electrode segment over the first surface of the active layer, the at least one reconfigurable electrode segment is arranged between the first electrode and the second electrode;
• arranging at least one reconfiguration layer over the second surface of the active layer, wherein the at least one reconfigurable electrode segment and the at least one reconfiguration layer overlaps;
• arranging one or more via contacts through the active layer from the first surface to the second surface, wherein the one or more via contacts are configured to couple the at least one reconfigurable electrode segment and the at least one reconfiguration layer;
• and
• coupling the at least one reconfiguration layer to a reconfiguration switch for reconfiguring electrical connections to the at least one reconfigurable electrode segment, wherein the MEMS device is configured to generate different resonant frequencies by reconfiguring the electrical connections to the at least one reconfigurable electrode segment using the reconfiguration switch.

A method for reconfiguring a resonant frequency of a microelectromechanical system (MEMS) device, comprising:

• providing a MEMS device comprising:
• an active layer having a first surface and a second surface;
• a first electrode and a second electrode arranged over the first surface of the active layer;
• at least one reconfigurable electrode segment arranged over the first surface of the active layer, the at least one reconfigurable electrode segment is arranged between the first electrode and the second electrode;
• at least one reconfiguration layer arranged over the second surface of the active layer, wherein the at least one reconfigurable electrode segment and the at least one reconfiguration layer overlaps;
• one or more via contacts disposed through the active layer from the first surface to the second surface, wherein the one or more via contacts are configured to couple the at least one reconfigurable electrode segment and the at least one reconfiguration layer;
• and
• wherein the at least one reconfiguration layer is coupled to a reconfiguration switch for reconfiguring electrical connections to the at least one reconfigurable electrode segment;
• applying an electrical signal to the reconfiguration switch to change an operation of the reconfiguration switch from a first configuration state to a second configuration state for reconfiguring an electrical connection to the at least one reconfigurable electrode segment;
• and
• applying the electrical signal to the first reconfigurable electrode segment by the reconfiguration switch, wherein the MEMS device generates a different resonant frequency in the second configuration state from the first configuration state.